DIAWAY now offers Virtuozzo Infrastructure Platform appliance powered by AMD EPYC™ 7002 series processors

TALLINN, ESTONIA August 8, 2019DIAWAY, premier builder of tailored-made storage, turnkey appliances and cloud solutions, announced today the launch and immediate availability of Virtuozzo Infrastructure Platform Appliance powered by AMD EPYC™ 7002 Series Processors.

“AMD EPYC 7002 Series Processors set a new standard for the modern datacenter with breakthrough performance, advanced features, and embedded security features to help defend against attacks to the CPU, applications and data. With more than twice the performance of our first-generation EPYC processors, customers can now transform their datacenter operations as their business workloads evolve,” said Scott Aylor, corporate vice president and general manager, Datacenter Solutions Group, AMD

DIAWAY announces CUBE today – the new generation of an all-flash hyper-converged infrastructure (HCI) appliance powered by AMD EPYC™ 7002 Series Processors that runs Virtuozzo infrastructure Platform software. DIAWAY CUBE is uniquely designed to “scale in” by converging storage and compute in a 4 node, 2U chassis.

DIAWAY redefines performance and affordability for the HCI market. AMD EPYC™ 7002 Generation Processors are expected to deliver up to 2X the performance-per socket and up to 4X peak FLOPS per-socket over AMD EPYC™ 7001 Series Processors.

DIAWAY provides a comprehensive software-defined “data center in a box” solution for service providers and enterprise environments to build on-premises and hybrid clouds.

Virtuozzo Infrastructure Platform delivers hyper-converged infrastructure combining resilient compute, software-defined storage for hot and cold data, virtual networking, and orchestration through a single, user-friendly management console, all in a scalable solution with streamlined operations.

DIAWAY CUBE appliance leverages rising edge-computing trend and delivers secure complete solution that would satisfy customers needs while lowering cost of ownership and providing the breakthrough performance.

“Best things in life are not things but moments. Now’s the moment to build great solutions redefined with performance, affordability and security – the very pillars AMD EPYC™ 7002 delivers upon.” – emphasizes Alexander Ragel, Managing Partner of DIAWAY.

Available immediately, the DIAWAY CUBE appliance has multiple pre-configured flavors starting in a 2U, 4 node footprint. Storage and compute scale independently to adapt to changes in the infrastructure environment.

ABOUT DIAWAY

DIAWAY is the premier builder of tailored-made storage, turnkey appliances and cloud solutions.
Designed and built infrastructure footprints are ranging in size from a hundred terabytes to hundreds petabytes.

Out of Tallinn, Estonia, DIAWAY operates globally.

To learn more, visit diaway.eu/cube

AMD, the AMD Arrow logo, EPYC and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.


1 Testing performed by AMD Engineering as of October 2018 using AMD reference system with a preproduction “Rome” engineering sample, where “Rome” scored approximately 2x higher compared to “Naples” System. Actual results with production silicon may vary.
2 Estimated generational increase based upon AMD internal design specifications for “Zen 2” compared to “Zen”. “Zen 2” has 2X the core density of “Zen”, and when multiplied by 2X peak FLOPs per core, at the same frequency, results in 4X the FLOPs in throughput. Actual results with production silicon may vary.

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